000 nam a22 7a 4500
999 _c68781
_d68781
001 4009442
003 FUTML
005 20171120152155.0
007 ta
008 171120s1996 si a grb 000 0 eng
010 _a 96195850
020 _a9810223072
037 _aB-25645
040 _aDLC
_cFUTML
_bEnglish
_dFUTML
050 0 0 _aTK7870.15
_b.H53 1996
082 0 0 _a621.381/046
_221
245 0 0 _aHigh performance design automation for multi-chip modules and packages /
_ceditor, Jun-Dong Cho ; co-editor, Paul D. Franzon.
260 _aSingapore ;
_aRiver Edge, NJ :
_bWorld Scientific,
_cc1996.
300 _ax, 254 p. :
_bill. ;
_c26 cm.
440 0 _aSelected topics in electronics and systems ;
_vvol. 5
_928931
504 _aIncludes bibliographical references.
590 _aB-25645/KAOS/17:11:20
650 0 _aElectronic packaging
_xDesign
_xData processing.
_928932
650 0 _aMultichip modules (Microelectronics)
_xDesign
_xData processing.
_928933
650 0 _aComputer-aided design.
_92556
700 1 _aCho, Jun-Dong
_928934
700 1 _aFranzon, Paul D.
_928935
912 _aK. Sadiku
_bK. Sadiku
_cD. Ladan
942 _2lcc
_cBKS
949 _aAwwal Ibrahim Library Bosso
_cTK7870.15.
_d.H53
_g2342132687
_nnc 1