000 nam a22 7a 4500
999 _c64196
_d64196
001 2559385
003 FUTML
005 20170525124949.0
007 ta
008 250517s1995 nyuaa b 001 0 eng d
010 _a 95010061
020 _a0070266913 (acidfree paper)
037 _aR-28367
040 _aDLC
_cFUTML
_dFUTML
050 0 0 _aTK7874
_b.H91 1995
245 0 0 _aHybrid microelectronics handbook /
_cedited by Jerry E. Sergent, Charles A. Harper.
_h(print resources)
250 _a2nd ed.
260 _aNew York :
_bMcGraw-Hill,
_cc1995.
300 _a1 v. (various pagings) :
_bill. ;
_c25 cm.
440 0 _aElectronic packaging and interconnection series
_9106
504 _aIncludes bibiographical references and index.
590 _aR-28367/KOLO/25/05/17
650 0 _aMicroelectronics
_xHandbooks, manuals, etc.
_920310
650 0 _aHybrid integrated circuits
_xDesign and construction
_xHandbooks, manuals, etc.
_920311
700 1 _aSergent, Jerry E.
_920312
700 1 _aHarper, Charles A.
_920313
700 1 _aHarper, Charles A.
_tHandbook of thick film hybrid microelectronics.
_920314
710 2 _aInternational Society for Hybrid Microelectronics.
_920315
856 4 1 _3Table of contents
_uhttp://www.loc.gov/catdir/toc/mh022/95010061.html
906 _a7
_bcbc
_corignew
_d1
_eocip
_f19
_gy-gencatlg
912 _aM. Kolo
_bM. Kolo
_cAbu
942 _2lcc
_cREFS
_e2nd ed.
949 _aIBB LIBRARY G K
_cTK7874.H91
_nnc1