High performance design automation for multi-chip modules and packages / 
editor, Jun-Dong Cho ; co-editor, Paul D. Franzon. 
 - Singapore ;  River Edge, NJ :  World Scientific,  c1996. 
 - x, 254 p. :  ill. ;  26 cm. 
 - Selected topics in electronics and systems ;  vol. 5 .
<br/><br/>Includes bibliographical references. 
<br/><br/><label>ISBN: </label>9810223072 
<br/><br/><label>Source: </label>B-25645 
<br/><br/><label>LCCN: </label>96195850  
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic packaging--Design--Data processing.<br/>Multichip modules (Microelectronics)--Design--Data processing.<br/>Computer-aided design.
<br/><br/><label>LC Class. No.: </label>TK7870.15  / .H53 1996 
<br/><br/><label>Dewey Class. No.: </label>621.381/046