Advances in embedded and fan-out wafer level packaging technologies / edited by Beth Keser and Steffen Kr�ohnert.-print
Contributor(s): Keser, Beth [editor.]
| Kr�oehnert, Steffen [editor.].
Material type: 
BookPublisher: Hoboken, NJ : Wiley, c2019Description: xxvii, 548 p. : ill. ; 24 cm.ISBN: 9781119314134.Subject(s): Chip scale packaging | Integrated circuits -- Wafer scale integration
| Item type | Current location | Call number | Copy number | Status | Date due | Barcode |
|---|---|---|---|---|---|---|
Books,Booklets,Workbooks
|
IBB Library-Gidan Kwano | TK7870. 17. A38 2019 (Browse shelf) | nc1 | Available | 2342144482 | |
|
Books,Booklets,Workbooks
|
IBB Library-Gidan Kwano | TK7870. 17. A38 2019 (Browse shelf) | nc2 | Available | 2342144513 |
Browsing IBB Library-Gidan Kwano Shelves Close shelf browser
| No cover image available |
|
|
|
|
|
|
||
| TK7870.P76 Prototyping and the use of test equipment/ | TK7870.S85 2006 Electronics : | TK7870.15. W66 1996 The handbook of machine soldering : | TK7870. 17. A38 2019 Advances in embedded and fan-out wafer level packaging technologies / | TK7870. 17. A38 2019 Advances in embedded and fan-out wafer level packaging technologies / | TK7870.2.S56 2007 Electronic and Electrical Servicing: Consumer and Commercial Electronics/ | TK7870.25.K73 1983 Thermal analysis and control of electronic equipment / |
Includes index.
B-45190/Kolo/23/05/2023
There are no comments for this item.