Advances in embedded and fan-out wafer level packaging technologies / print
edited by Beth Keser and Steffen Kr�ohnert.-
- xxvii, 548 p. : ill. ; 24 cm
Includes index.
9781119314134
B-45190
Chip scale packaging.
Integrated circuits--Wafer scale integration.
TK7870.17 / .A38 2019
Includes index.
9781119314134
B-45190
Chip scale packaging.
Integrated circuits--Wafer scale integration.
TK7870.17 / .A38 2019